Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM CUI Devices	4,468 In Stock	1 : ¥5.99000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
HSB07-202009 HEAT SINK, BGA, 20 X 20 X 9 MM CUI Devices	1,750 In Stock	1 : ¥6.90000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	3.1W @ 75°C	8.60°C/W @ 200 LFM	24.08°C/W	Aluminum Alloy	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM CUI Devices	1,905 In Stock	1 : ¥7.47000 Tray	HSB	Tray	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized
HSB09-212115 HEAT SINK, BGA, 21 X 21 X 15 MM CUI Devices	1,269 In Stock	1 : ¥7.63000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.591" (15.00mm)	4.3W @ 75°C	6.00°C/W @ 200 LFM	17.39°C/W	Aluminum Alloy	Black Anodized
HSB20-353525 HEAT SINK, BGA, 35 X 35 X 25 MM CUI Devices	252 In Stock	1 : ¥16.25000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.378" (35.00mm)	1.378" (35.00mm)	-	0.984" (25.00mm)	11.3W @ 75°C	2.70°C/W @ 200 LFM	6.65°C/W	Aluminum Alloy	Black Anodized
HSB10-232306 HEAT SINK, BGA, 23 X 23 X 6 MM CUI Devices	1,207 In Stock	1 : ¥6.90000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.236" (6.00mm)	3.0W @ 75°C	9.60°C/W @ 200 LFM	25.46°C/W	Aluminum Alloy	Black Anodized
V2030A HEATSINK CPU FORGED Assmann WSW Components	1,721 In Stock	1 : ¥12.40000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.256" (6.50mm)	-	-	6.50°C/W	Aluminum Alloy	Clean Finished
ATS-61700W-C2-R0 FANSINK ASSEMBLY W/ MOUNTING HAR Advanced Thermal Solutions Inc.	129 In Stock	1 : ¥215.17000 Bulk	fanSINK™	Bulk	Active	Top Mount	BGA	Push Pin, Thermal Material	Square, Pin Fins	2.913" (74.00mm)	2.913" (74.00mm)	-	0.965" (24.50mm)	-	-	-	-	-
HSB24-252510 HEAT SINK, BGA,25 X 25 X 10 MM CUI Devices	786 In Stock	1 : ¥6.65000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	4.14W @ 75°C	6.50°C/W @ 200 LFM	18.10°C/W	Aluminum Alloy	Black Anodized
HSB13-303014 HEAT SINK, BGA, 30.7 X 30.7 X 14 CUI Devices	317 In Stock	1 : ¥7.80000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.209" (30.70mm)	1.209" (30.70mm)	-	0.551" (14.00mm)	6.1W @ 75°C	4.70°C/W @ 200 LFM	12.36°C/W	Aluminum Alloy	Black Anodized
ATS-54230W-C1-R0 HEAT SINK 23MM X 23MM X 24.5MM Advanced Thermal Solutions Inc.	38 In Stock	1 : ¥89.16000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	0.900" (23.00mm)	0.906" (23.01mm)	-	0.965" (24.50mm)	-	5.60°C/W @ 200 LFM	-	Aluminum	Black Anodized
374124B00035G HEATSINK BGA W/ADHESIVE TAPE Boyd Laconia, LLC	0 In Stock	Active	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.906" (23.01mm)	0.906" (23.01mm)	-	0.709" (18.00mm)	2.0W @ 50°C	7.40°C/W @ 200 LFM	23.40°C/W	Aluminum	Black Anodized
960-23-33-F-AB-0 HEATSINK 23X33MM FRONT PUSH PIN Wakefield-Vette	0 In Stock Check Lead Time	400 : ¥39.11975 Box	960	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	1.299" (33.00mm)	-	2.80°C/W @ 200 LFM	-	Aluminum	Black Anodized

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Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.