IC Clips

Results: 10
Series
923927
Packaging
BoxTray
Type
DIP, .300"DIP, 0.3" Row SpacingPLCC, .050"SOIC, 0.15" Body
Number of Positions or Pins (Grid)
8 (2 x 4)16 (2 x 8)20 (2 x 10)28 (2 x 14)68 (4 x 17)
Contact Finish
-Gold
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Contact Finish
Contact Material
923675-68
923675-68
TEST CLIP PLCC 68 (4 X 17)
3M
191
In Stock
1 : ¥869.93000
Tray
Tray
Active
PLCC, .050"
68 (4 x 17)
Gold
Copper Alloy
923695
923695
TEST CLIP DIP 8 (2 X 4)
3M
24
In Stock
1 : ¥244.58000
Tray
Tray
Active
DIP, .300"
8 (2 x 4)
-
Copper Alloy
923700
923700
TEST CLIP DIP 16 (2 X 8)
3M
19
In Stock
1 : ¥249.43000
Box
Box
Active
DIP, .300"
16 (2 x 8)
-
Copper Alloy
923690-08
923690-08
TEST CLIP DIP 8 (2 X 4)
3M
14
In Stock
1 : ¥262.01000
Box
Box
Active
DIP, .300"
8 (2 x 4)
-
Copper Alloy
923650-08
923650-08
TEST CLIP SOIC 8 (2 X 4)
3M
16
In Stock
1 : ¥292.53000
Tray
Tray
Active
SOIC, 0.15" Body
8 (2 x 4)
-
Copper Alloy
923655-08
923655-08
TEST CLIP SOIC 8 (2 X 4)
3M
24
In Stock
1 : ¥303.58000
Tray
Tray
Active
SOIC, 0.15" Body
8 (2 x 4)
Gold
Copper Alloy
923739-08
923739-08
TEST CLIP DIP 8 (2 X 4)
3M
16
In Stock
1 : ¥318.03000
Box
Box
Active
DIP, .300"
8 (2 x 4)
Gold
Copper Alloy
927739-16
927739-16
TEST CLIP DIP 16 (2 X 8)
3M
12
In Stock
1 : ¥545.69000
Box
Box
Active
DIP, 0.3" Row Spacing
16 (2 x 8)
Gold
Copper Alloy
927738-28
927738-28
TEST CLIP DIP 28 (2 X 14)
3M
9
In Stock
1 : ¥3,153.27000
Box
Box
Active
DIP, 0.3" Row Spacing
28 (2 x 14)
Gold
Copper Alloy
927739-20
927739-20
TEST CLIP DIP 20 (2 X 10)
3M
0
In Stock
Check Lead Time
10 : ¥843.44800
Box
Box
Active
DIP, 0.3" Row Spacing
20 (2 x 10)
Gold
Copper Alloy
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IC Clips


Test Clips for ICs are most often used between an IC chip and a measurement device to provide a temporary electrical connection. Items in this family are spring loaded and have multiple contact points designed to be attached to the leads of an IC. The types of ICs are DIP, LCC, PLCC, QFP, SOIC, and SSOP, with the number of positions ranging from 8 (1 x 8 or 2 x 4) to 240 (17 x 17).