Solder

Results: 4
Manufacturer
Chip Quik Inc.Kester Solder
Series
-268CHIPQUIK®SMD3
Composition
Sn62Pb36Ag2 (62/36/2)Sn96.5Ag3Cu0.5 (96.5/3/0.5)Sn99.3Cu0.7 (99.3/0.7)
Diameter
0.015" (0.38mm)0.040" (1.02mm)
Melting Point
354°F (179°C)422 ~ 428°F (217 ~ 220°C)441°F (227°C)
Flux Type
No-CleanNo-Clean, Water SolubleRosin Activated (RA)
Wire Gauge
18 AWG, 19 SWG27 AWG, 28 SWG-
Process
-Lead FreeLeaded
Form
Spool, 1 oz (28.35g)Spool, 17.64 oz (500g)Spool, 3.53 oz (100g)Spool, 8 oz (226.80g)
Shelf Life
36 Months-
Shelf Life Start
-Date of Manufacture
Storage/Refrigeration Temperature
50°F ~ 104°F (10°C ~ 40°C)-
Stocking Options
Environmental Options
Media
Marketplace Product
4Results
Showing
of 4
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Composition
Diameter
Melting Point
Flux Type
Wire Gauge
Process
Form
Shelf Life
Shelf Life Start
Storage/Refrigeration Temperature
268 Flux-Cored Wire
96-9574-9540
K100LD 3.3%/268 .040 500 G ROBO
Kester Solder
79
In Stock
1 : ¥852.53000
Bulk
Bulk
Active
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.040" (1.02mm)
441°F (227°C)
No-Clean
18 AWG, 19 SWG
Lead Free
Spool, 17.64 oz (500g)
36 Months
Date of Manufacture
50°F ~ 104°F (10°C ~ 40°C)
RASWLF.015 1OZ
RASWLF.015 1OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Chip Quik Inc.
40
In Stock
1 : ¥70.43000
Bulk
-
Bulk
Active
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.015" (0.38mm)
422 ~ 428°F (217 ~ 220°C)
Rosin Activated (RA)
27 AWG, 28 SWG
Lead Free
Spool, 1 oz (28.35g)
-
-
-
SMD3SW.015
SMD3SW.015 100G
SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Chip Quik Inc.
21
In Stock
1 : ¥228.52000
Bulk
Bulk
Active
Wire Solder
Sn62Pb36Ag2 (62/36/2)
0.015" (0.38mm)
354°F (179°C)
No-Clean, Water Soluble
27 AWG, 28 SWG
Leaded
Spool, 3.53 oz (100g)
-
-
-
NC2SWLF.015 8OZ
NC2SWLF.015 8OZ
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Chip Quik Inc.
30
In Stock
1 : ¥344.58000
Bulk
Bulk
Active
Wire Solder
Sn99.3Cu0.7 (99.3/0.7)
0.015" (0.38mm)
441°F (227°C)
No-Clean
-
-
Spool, 8 oz (226.80g)
-
-
-
Showing
of 4

Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.