Solder

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Composition	Diameter	Melting Point	Flux Type	Wire Gauge	Mesh Type	Process	Form	Shelf Life	Shelf Life Start	Storage/Refrigeration Temperature

SMDLTLFP SOLDER PASTE LOW TEMP 5CC W/TIP Chip Quik Inc.	80 In Stock	1 : ¥138.49000 Dispenser	-	Dispenser	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	3	Lead Free	Syringe, 0.53 oz (15g), 5cc	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
SMD291SNL50T3 SLDR PASTE NO-CLN SAC305 50G Chip Quik Inc.	24 In Stock	1 : ¥147.18000 Bulk	-	Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	3	Lead Free	Jar, 1.76 oz (50g)	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
TS391LT THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.	24 In Stock	1 : ¥147.18000 Bulk	-	Bulk	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	4	Lead Free	Syringe, 0.53 oz (15g), 5cc	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
TS391LT10 THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.	15 In Stock	1 : ¥251.37000 Bulk	-	Bulk	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	4	Lead Free	Syringe, 1.23 oz (35g), 10cc	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
TS391SNL250 THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.	22 In Stock	1 : ¥607.37000 Bulk	-	Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	4	Lead Free	Jar, 8.8 oz (250g)	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
WS991SNL500T4 SOLDER PASTE THERMALLY STABLE WS Chip Quik Inc.	9 In Stock	1 : ¥853.63000 Bulk	CHIPQUIK®	Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423°F (217°C)	Water Soluble	-	4	Lead Free	Jar, 17.64 oz (500g)	6 Months	Date of Manufacture	-
SMDLTLFP15T4 TWO PART MIX SOLDER PASTE Chip Quik Inc.	7 In Stock	1 : ¥173.22000 Bulk	-	Bulk	Active	Solder Paste, Two Part Mix	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	281°F (138°C)	No-Clean	-	4	Lead Free	Jar, 0.53 oz (15g)	24 Months	Date of Manufacture	37°F ~ 77°F (3°C ~ 25°C)
NC191LT50T5 SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc.	11 In Stock	1 : ¥242.69000 Bulk	Smooth Flow™	Bulk	Active	Solder Paste	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	-	280°F (138°C)	No-Clean	-	5	Lead Free	Jar, 1.76 oz (50g)	6 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)
TS391SNL50 THERMALLY STABLE SOLDER PASTE NO Chip Quik Inc.	0 In Stock Check Lead Time	1 : ¥155.86000 Bulk	-	Bulk	Active	Solder Paste	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	-	423 ~ 428°F (217 ~ 220°C)	No-Clean	-	4	Lead Free	Jar, 1.76 oz (50g)	12 Months	Date of Manufacture	68°F ~ 77°F (20°C ~ 25°C)
NC191LTA50 SMOOTH FLOW LOW TEMP SOLDER PAST Chip Quik Inc.	0 In Stock Check Lead Time	1 : ¥164.54000 Bulk	Smooth Flow™	Bulk	Active	Solder Paste	Bi57Sn42Ag1 (57/42/1)	-	279°F (137°C)	No-Clean	-	4	-	Jar, 1.76 oz (50g)	12 Months	Date of Manufacture	37°F ~ 46°F (3°C ~ 8°C)

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Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.