IC Sockets

Results: 620
Manufacturer
Aries ElectronicsMill-Max Manufacturing Corp.Preci-Dip
Packaging
-BulkTube
Type
DIP, 0.2" (5.08mm) Row SpacingDIP, 0.3" (7.62mm) Row SpacingDIP, 0.4" (10.16mm) Row SpacingDIP, 0.6" (15.24mm) Row SpacingDIP, 0.9" (22.86mm) Row SpacingPGASIP
Number of Positions or Pins (Grid)
1 (1 x 1)2 (1 x 2)3 (1 x 3)4 (1 x 4)4 (2 x 2)5 (1 x 5)6 (1 x 6)6 (2 x 3)7 (1 x 7)8 (1 x 8)8 (2 x 4)9 (1 x 9)
Pitch - Mating
0.050" (1.27mm)0.100" (2.54mm)
Contact Finish - Mating
-Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)30.0µin (0.76µm)-Flash
Mounting Type
Surface MountThrough Hole
Features
Closed FrameOpen Frame
Pitch - Post
0.050" (1.27mm)0.100" (2.54mm)
Contact Finish - Post
-GoldTinTin-Lead
Contact Finish Thickness - Post
10.0µin (0.25µm)200.0µin (5.08µm)-Flash
Contact Material - Post
BrassBrass Alloy
Housing Material
FR4 Epoxy GlassPolyamide (PA46), Nylon 4/6, Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C-
Stocking Options
Environmental Options
Media
Marketplace Product
620Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
08-3518-00
08-3518-00
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
3,696
In Stock
1 : ¥17.65000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
40-0518-10
40-0518-10
CONN SOCKET SIP 40POS GOLD
Aries Electronics
3,062
In Stock
1 : ¥33.17000
Bulk
Bulk
Active
SIP
40 (1 x 40)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-3518-10
08-3518-10
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
2,464
In Stock
1 : ¥7.22000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-0518-10
08-0518-10
CONN SOCKET SIP 8POS GOLD
Aries Electronics
2,854
In Stock
1 : ¥10.34000
Bulk
Bulk
Active
SIP
8 (1 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-3518-10
14-3518-10
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
784
In Stock
1 : ¥11.41000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
10-0518-10
10-0518-10
CONN SOCKET SIP 10POS GOLD
Aries Electronics
661
In Stock
1 : ¥11.41000
Bulk
Bulk
Active
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
16-3518-10
16-3518-10
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
1,456
In Stock
1 : ¥13.22000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-3518-10
20-3518-10
CONN IC DIP SOCKET 20POS GOLD
Aries Electronics
605
In Stock
1 : ¥14.78000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-3518-11
08-3518-11
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
251
In Stock
1 : ¥14.78000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
28-6518-10
28-6518-10
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
760
In Stock
1 : ¥20.94000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
28-3518-10
28-3518-10
CONN IC DIP SOCKET 28POS GOLD
Aries Electronics
426
In Stock
1 : ¥23.81000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
40-0518-11
40-0518-11
CONN SOCKET SIP 40POS GOLD
Aries Electronics
148
In Stock
1 : ¥52.71000
Bulk
Bulk
Active
SIP
40 (1 x 40)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
40-6518-10
40-6518-10
CONN IC DIP SOCKET 40POS GOLD
Aries Electronics
1,459
In Stock
1 : ¥56.48000
Bulk
Bulk
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
16-3518-10T
16-3518-10T
CONN IC DIP SOCKET 16POS GOLD
Aries Electronics
724
In Stock
1 : ¥12.56000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-3518-10
24-3518-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
108
In Stock
1 : ¥18.55000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-6518-10
24-6518-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
217
In Stock
1 : ¥19.05000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
22-4518-10
22-4518-10
CONN IC DIP SOCKET 22POS GOLD
Aries Electronics
224
In Stock
1 : ¥23.64000
Bulk
Bulk
Active
DIP, 0.4" (10.16mm) Row Spacing
22 (2 x 11)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
32-6518-10
32-6518-10
CONN IC DIP SOCKET 32POS GOLD
Aries Electronics
190
In Stock
1 : ¥23.81000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
24-4518-10
24-4518-10
CONN IC DIP SOCKET 24POS GOLD
Aries Electronics
718
In Stock
1 : ¥26.93000
Bulk
Bulk
Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
14-3518-101
14-3518-101
CONN IC DIP SOCKET 14POS GOLD
Aries Electronics
174
In Stock
1 : ¥36.86000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-0518-00
20-0518-00
CONN SOCKET SIP 20POS GOLD
Aries Electronics
173
In Stock
1 : ¥39.41000
Bulk
Bulk
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN SOCKET SIP 5POS GOLD
05-0518-00
CONN SOCKET SIP 5POS GOLD
Aries Electronics
376
In Stock
1 : ¥9.85000
Bulk
Bulk
Active
SIP
5 (1 x 5)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Surface Mount
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
CONN SOCKET SIP 2POS GOLD
02-0518-10
CONN SOCKET SIP 2POS GOLD
Aries Electronics
12,504
In Stock
1 : ¥4.27000
Bulk
Bulk
Active
SIP
2 (1 x 2)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
18-3518-10
18-3518-10
CONN IC DIP SOCKET 18POS GOLD
Aries Electronics
61
In Stock
1 : ¥16.34000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
08-3518-10T
08-3518-10T
CONN IC DIP SOCKET 8POS GOLD
Aries Electronics
692
In Stock
1 : ¥6.98000
Bulk
Bulk
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
Showing
of 620

IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.