Single Diodes

Results: 2
Manufacturer
onsemiSTMicroelectronics
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkyStandard
Voltage - DC Reverse (Vr) (Max)
60 V100 V
Current - Average Rectified (Io)
200mA3A
Voltage - Forward (Vf) (Max) @ If
620 mV @ 3 A1 V @ 10 mA
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
25 nA @ 20 V150 µA @ 60 V
Capacitance @ Vr, F
4pF @ 0V, 1MHz-
Package / Case
DO-213AC, MINI-MELF, SOD-80DO-214AA, SMB
Supplier Device Package
SMBSOD-80
Operating Temperature - Junction
-55°C ~ 175°C150°C (Max)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
31-MINIMELF
LL4148
DIODE GEN PURP 100V 200MA SOD80
onsemi
584,910
In Stock
1 : ¥0.90000
Cut Tape (CT)
2,500 : ¥0.15661
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Standard
100 V
200mA
1 V @ 10 mA
Small Signal =< 200mA (Io), Any Speed
4 ns
25 nA @ 20 V
4pF @ 0V, 1MHz
Surface Mount
DO-213AC, MINI-MELF, SOD-80
SOD-80
-55°C ~ 175°C
DO-214AA
STPS3L60U
DIODE SCHOTTKY 60V 3A SMB
STMicroelectronics
47,396
In Stock
1 : ¥4.10000
Cut Tape (CT)
2,500 : ¥1.11341
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Schottky
60 V
3A
620 mV @ 3 A
Fast Recovery =< 500ns, > 200mA (Io)
-
150 µA @ 60 V
-
Surface Mount
DO-214AA, SMB
SMB
150°C (Max)
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Single Diodes


Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.