Arrays, Edge Type, Mezzanine (Board to Board)

Results: 3
Manufacturer
Hirose Electric Co LtdMolex
Series
211175BM23SlimStack 51338
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Number of Positions
8 (4 + 4 Power)2470
Pitch
0.014" (0.35mm)0.016" (0.40mm)-
Contact Finish Thickness
1.97µin (0.050µm)4.00µin (0.100µm)8.00µin (0.203µm)
Mated Stacking Heights
0.7mm0.8mm1.5mm
Height Above Board
0.028" (0.71mm)0.031" (0.80mm)0.053" (1.35mm)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Connector Type
Number of Positions
Pitch
Number of Rows
Mounting Type
Features
Contact Finish
Contact Finish Thickness
Mated Stacking Heights
Height Above Board
0513380774
0513380774
CONN RCPT 70POS SMD GOLD
Molex
3,720
In Stock
1 : ¥26.93000
Cut Tape (CT)
2,500 : ¥17.12693
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Receptacle, Center Strip Contacts
70
0.016" (0.40mm)
2
Surface Mount
Solder Retention
Gold
8.00µin (0.203µm)
1.5mm
0.053" (1.35mm)
2111750080
2111750080
0.35 B/B REC EMBSTP PKG 4+4CKT
Molex
8,494
In Stock
1 : ¥3.94000
Cut Tape (CT)
15,000 : ¥0.92360
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Receptacle, Center Strip Contacts
8 (4 + 4 Power)
-
2
Surface Mount
Solder Retention
Gold
4.00µin (0.100µm)
0.7mm
0.028" (0.71mm)
830
In Stock
1 : ¥11.08000
Cut Tape (CT)
1,000 : ¥5.69153
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Receptacle, Center Strip Contacts
24
0.014" (0.35mm)
2
Surface Mount
Solder Retention
Gold
1.97µin (0.050µm)
0.8mm
0.031" (0.80mm)
Showing
of 3

Arrays, Edge Type, Mezzanine (Board to Board)


Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.