I/O Expanders

Results: 3
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)8-XFDFN Exposed Pad
Supplier Device Package
8-VSSOP8-X2SON (1.35x0.8)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
DigiKey Programmable
Number of I/O
Interface
Interrupt Output
Features
Output Type
Current - Output Source/Sink
Clock Frequency
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
8-VSSOP
TCA9536DGKR
IC XPNDR 1MHZ I2C SMBUS 8VSSOP
Texas Instruments
23,806
In Stock
1 : ¥8.93000
Cut Tape (CT)
2,500 : ¥4.78194
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Not Verified
4
I2C, SMBus
Yes
POR
Open Drain
10mA, 25mA
1 MHz
1.65V ~ 5.5V
-40°C ~ 125°C
Surface Mount
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
8-VSSOP
8-X2SON
TCA9536DTMR
IC XPNDR 1MHZ I2C SMBUS 8X2SON
Texas Instruments
11,986
In Stock
1 : ¥12.31000
Cut Tape (CT)
5,000 : ¥4.96270
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Not Verified
4
I2C, SMBus
Yes
POR
Open Drain
10mA, 25mA
1 MHz
1.65V ~ 5.5V
-40°C ~ 125°C
Surface Mount
8-XFDFN Exposed Pad
8-X2SON (1.35x0.8)
8-X2SON
TCA9536BDTMR
IC XPNDR 1MHZ I2C SMBUS 8X2SON
Texas Instruments
0
In Stock
Check Lead Time
1 : ¥18.62000
Cut Tape (CT)
5,000 : ¥5.13885
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Not Verified
4
I2C, SMBus
Yes
POR
Open Drain
10mA, 25mA
1 MHz
1.65V ~ 5.5V
-40°C ~ 125°C
Surface Mount
8-XFDFN Exposed Pad
8-X2SON (1.35x0.8)
Showing
of 3

I/O Expanders


Devices in this family are used in conjunction with microcontrollers, microprocessors, or similar devices for the purpose of increasing the number of signal connections available for connecting peripheral devices. The typical concept of operation involves the use of serial communications requiring only a few I/O lines on the host device to read/write the status of many input/output pins on the expander device. The technique exchanges speed of communication for increased connectivity, and is best suited for applications where fast response is not critical, such as in many human interface applications.