Heat Sinks

Results: 2
Manufacturer
Boyd Laconia, LLCCUI Devices
Series
5731HSB
Packaging
BulkTray
Package Cooled
BGATO-252 (DPak)
Attachment Method
Adhesive (Not Included)SMD Pad
Shape
Rectangular, FinsSquare, Pin Fins
Length
0.315" (8.00mm)0.472" (12.00mm)
Width
0.472" (12.00mm)0.900" (22.86mm)
Fin Height
0.400" (10.16mm)0.709" (18.00mm)
Power Dissipation @ Temperature Rise
0.8W @ 30°C3.1W @ 75°C
Thermal Resistance @ Forced Air Flow
9.60°C/W @ 200 LFM12.50°C/W @ 600 LFM
Thermal Resistance @ Natural
15.00°C/W24.01°C/W
Material
AluminumAluminum Alloy
Material Finish
Black AnodizedTin
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB03-121218
HSB03-121218
HEAT SINK, BGA, 12 X 12 X 18 MM
CUI Devices
1,905
In Stock
1 : ¥7.47000
Tray
Tray
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.472" (12.00mm)
0.472" (12.00mm)
-
0.709" (18.00mm)
3.1W @ 75°C
9.60°C/W @ 200 LFM
24.01°C/W
Aluminum Alloy
Black Anodized
573100D00000G
573100D00000G
TOP MOUNT HEATSINK .4" D-PAK
Boyd Laconia, LLC
2,478
In Stock
1 : ¥16.17000
Bulk
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
15.00°C/W
Aluminum
Tin
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.