Heat Sinks

Results: 3
Manufacturer
Assmann WSW ComponentsBoyd Laconia, LLCWakefield-Vette
Series
-625
Packaging
BagBulk
Type
Board LevelTop Mount
Package Cooled
24-DIPBGASOT-32, TO-220
Attachment Method
Bolt On and PC PinThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
Rectangular, FinsSquare, Pin Fins
Length
0.984" (25.00mm)1.250" (31.75mm)1.500" (38.10mm)
Width
0.530" (13.46mm)0.640" (16.26mm)0.984" (25.00mm)
Fin Height
0.190" (4.83mm)0.350" (8.89mm)0.640" (16.26mm)
Power Dissipation @ Temperature Rise
1.0W @ 40°C-
Thermal Resistance @ Forced Air Flow
13.10°C/W @ 200 LFM15.00°C/W @ 500 LFM-
Thermal Resistance @ Natural
8.50°C/W34.00°C/W-
Stocking Options
Environmental Options
Media
Marketplace Product
3Results
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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
508500B00000G
508500B00000G
HEATSINK 24-PIN DIP GLUE-ON BLK
Boyd Laconia, LLC
6,070
In Stock
1 : ¥8.70000
Bag
-
Bag
Active
Top Mount
24-DIP
Thermal Tape, Adhesive (Not Included)
Rectangular, Fins
1.250" (31.75mm)
0.530" (13.46mm)
-
0.190" (4.83mm)
1.0W @ 40°C
15.00°C/W @ 500 LFM
34.00°C/W
Aluminum
Black Anodized
HEATSINK FOR 25MM BGA
625-35AB
HEATSINK FOR 25MM BGA
Wakefield-Vette
392
In Stock
1 : ¥16.67000
Bulk
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.350" (8.89mm)
-
13.10°C/W @ 200 LFM
-
Aluminum
Black Anodized
V9582X-LP
V9582X-LP
HEATSINK SOT-32 TO-220
Assmann WSW Components
486
In Stock
1 : ¥6.24000
Bulk
-
Bulk
Active
Board Level
SOT-32, TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
0.640" (16.26mm)
-
0.640" (16.26mm)
-
-
8.50°C/W
Aluminum
Black Anodized
Showing
of 3

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.