Heat Sinks

Results: 2
Fin Height
0.394" (10.00mm)0.866" (22.00mm)
Power Dissipation @ Temperature Rise
7.4W @ 75°C15.83W @ 75°C
Thermal Resistance @ Forced Air Flow
1.40°C/W @ 200 LFM2.70°C/W @ 200 LFM
Thermal Resistance @ Natural
4.74°C/W10.09°C/W
Material Finish
Black AnodizedClean Finished
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB28-606022
HSB28-606022
HEAT SINK, BGA, 60 X 60 X 22 MM,
CUI Devices
240
In Stock
1 : ¥54.43000
Box
Box
Active
Top Mount
BGA
Push Pin
Square, Pin Fins
2.362" (60.00mm)
2.362" (60.00mm)
-
0.866" (22.00mm)
15.83W @ 75°C
1.40°C/W @ 200 LFM
4.74°C/W
Aluminum Alloy
Black Anodized
HSB44-606010P
HSB44-606010P
HEAT SINK, BGA, 60 X 60 X 10 MM,
CUI Devices
101
In Stock
1 : ¥53.77000
Box
Box
Active
Top Mount
BGA
Push Pin
Square, Pin Fins
2.362" (60.00mm)
2.362" (60.00mm)
-
0.394" (10.00mm)
7.4W @ 75°C
2.70°C/W @ 200 LFM
10.09°C/W
Aluminum Alloy
Clean Finished
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.