Heat Sinks

Results: 2
Manufacturer
Boyd Laconia, LLCWakefield-Vette
Packaging
BoxBulk
Type
Board Level, VerticalTop Mount, Extrusion
Package Cooled
DC/DC ConverterTO-218, TO-220, TO-247, Multiwatt
Attachment Method
AdhesiveBolt On and PC Pin
Length
1.650" (41.91mm)12.000" (304.80mm)
Width
1.000" (25.40mm)2.280" (57.91mm)
Fin Height
0.935" (23.75mm)2.500" (63.50mm)
Power Dissipation @ Temperature Rise
4.0W @ 20°C-
Thermal Resistance @ Forced Air Flow
1.50°C/W @ 400 LFM-
Thermal Resistance @ Natural
0.07°C/W2.70°C/W
Material Finish
-Black Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
6400BG
6400BG
BOARD LEVEL HEAT SINK
Boyd Laconia, LLC
2,528
In Stock
1 : ¥27.58000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-218, TO-220, TO-247, Multiwatt
Bolt On and PC Pin
Rectangular, Fins
1.650" (41.91mm)
1.000" (25.40mm)
-
2.500" (63.50mm)
4.0W @ 20°C
1.50°C/W @ 400 LFM
2.70°C/W
Aluminum
Black Anodized
125349
125349
2.28WX12" EXTRUSION 14228
Wakefield-Vette
1,428
In Stock
1 : ¥133.90000
Box
-
Box
Active
Top Mount, Extrusion
DC/DC Converter
Adhesive
Rectangular, Fins
12.000" (304.80mm)
2.280" (57.91mm)
-
0.935" (23.75mm)
-
-
0.07°C/W
Aluminum
-
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.