Heat Sinks

Results: 2
Manufacturer
Boyd Laconia, LLCOhmite
Series
-CR
Packaging
BagBox
Type
Board LevelBoard Level, Vertical
Package Cooled
TO-220TO-401
Attachment Method
2 Clips and PC PinBolt On
Length
0.750" (19.05mm)1.969" (50.00mm)
Width
0.520" (13.21mm)2.953" (75.00mm)
Fin Height
0.500" (12.70mm)-
Power Dissipation @ Temperature Rise
1.5W @ 40°C-
Thermal Resistance @ Forced Air Flow
10.00°C/W @ 200 LFM-
Thermal Resistance @ Natural
3.80°C/W24.40°C/W
Material
AluminumAluminum Alloy
Material Finish
Black AnodizedDegreased
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
577202B00000G
577202B00000G
HEAT SINK TO-220 .500" COMPACT
Boyd Laconia, LLC
6,490
In Stock
1 : ¥4.10000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.500" (12.70mm)
1.5W @ 40°C
10.00°C/W @ 200 LFM
24.40°C/W
Aluminum
Black Anodized
CR101-75VE
CR401-50VE
ALUMINUM HEATSINK 50MM DEGREASED
Ohmite
2
In Stock
1 : ¥36.78000
Box
Box
Active
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
1.969" (50.00mm)
2.953" (75.00mm)
-
-
-
-
3.80°C/W
Aluminum Alloy
Degreased
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.