System On Chip (SoC)

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Grade	Qualification	Package / Case	Supplier Device Package

SC-20100S-A SITCORE SC20100S SOC GHI Electronics, LLC	250 In Stock	1 : ¥180.62000 Box	-	Box	Active	MPU	ARM Cortex-M7	2MB	1MB	PWM	CANbus, Ethernet, I2C, MMC/SD, SPI, UART/USART, USB	480MHz	-	-40°C ~ 85°C	-	-	100-LQFP	100-LQFP (14x14)
M2S025-FGG484 IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	339 In Stock	1 : ¥688.85000 Tray	SmartFusion®2	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	484-BGA	484-FPBGA (23x23)
XC7Z010-2CLG225I IC SOC CORTEX-A9 766MHZ 225BGA AMD	147 In Stock	1 : ¥812.61000 Tray	Zynq®-7000	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	766MHz	Artix™-7 FPGA, 28K Logic Cells	-40°C ~ 100°C (TJ)	-	-	225-LFBGA, CSPBGA	225-CSPBGA (13x13)
M2S025-FGG484I IC SOC CORTEX-M3 166MHZ 484FBGA Microchip Technology	154 In Stock	1 : ¥861.00000 Tray	SmartFusion®2	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	484-BGA	484-FPBGA (23x23)
XC7Z020-1CLG484C IC SOC CORTEX-A9 667MHZ 484BGA AMD	636 In Stock	1 : ¥1,238.04000 Tray	Zynq®-7000	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	667MHz	Artix™-7 FPGA, 85K Logic Cells	0°C ~ 85°C (TJ)	-	-	484-LFBGA, CSPBGA	484-CSPBGA (19x19)
M2S025-VFG256I IC SOC CORTEX-M3 166MHZ 256FBGA Microchip Technology	129 In Stock	1 : ¥765.32000 Tray	SmartFusion®2	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	256-LBGA	256-FPBGA (17x17)
M2S025T-FCSG158I M2S025T-FCSG158I Microchip Technology	512 In Stock	1 : ¥660.20000 Tray	-	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	158-BGA, FCBGA	158-FCBGA
TDA4VL21HGAALZRQ1 AUTOMOTIVE SYSTEM-ON-A-CHIP WITH Texas Instruments	248 In Stock	1 : ¥739.18000 Cut Tape (CT) 250 : ¥619.94272 Tape & Reel (TR)	-	Tape & Reel (TR) Cut Tape (CT) Digi-Reel®	Active	DSP, MCU, MPU	ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x	-	1.5MB	DMA, PWM, WDT	MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB	2GHz, 1GHz, 1GHz	-	-40°C ~ 125°C (TJ)	Automotive	AEC-Q100	770-BFBGA, FCBGA	770-FCBGA (23x23)
MPFS025T-FCVG484E IC SOC RISC-V 484FCBGA Microchip Technology	5 In Stock	1 : ¥587.60000 Tray	PolarFire®	Tray	Active	MPU, FPGA	RISC-V	128KB	230.4KB	DMA, PCI, PWM	CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG	-	FPGA - 23K Logic Modules	0°C ~ 100°C	-	-	484-BFBGA, FCBGA	484-FCBGA (19x19)
A2F200M3F-FGG256I IC SOC CORTEX-M3 80MHZ 256FBGA Microchip Technology	0 In Stock Check Lead Time	1 : ¥414.10000 Tray	SmartFusion®	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	80MHz	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	-40°C ~ 100°C (TJ)	-	-	256-LBGA	256-FPBGA (17x17)
M2S025-FCSG325 IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	0 In Stock Check Lead Time	176 : ¥495.21773 Tray	SmartFusion®2	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	0°C ~ 85°C (TJ)	-	-	325-TFBGA, FCBGA	325-FCBGA (11x11)
M2S025-FCS325I IC SOC CORTEX-M3 166MHZ 325BGA Microchip Technology	0 In Stock Check Lead Time	176 : ¥619.18722 Tray	SmartFusion®2	Tray	Active	MCU, FPGA	ARM® Cortex®-M3	256KB	64KB	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	166MHz	FPGA - 25K Logic Modules	-40°C ~ 100°C (TJ)	-	-	325-TFBGA, FCBGA	325-FCBGA (11x11)

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Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.