Microprocessors

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Core Processor	Number of Cores/Bus Width	Speed	Co-Processors/DSP	RAM Controllers	Graphics Acceleration	Display & Interface Controllers	Ethernet	SATA	USB	Voltage - I/O	Operating Temperature	Security Features	Mounting Type	Package / Case	Supplier Device Package	Additional Interfaces

AM5728BABCXA IC MPU SITARA 1.5GHZ 760FCBGA Texas Instruments	54 In Stock	1 : ¥650.85000 Tray	Sitara™	Tray	Active	ARM® Cortex®-A15	2 Core, 32-Bit	1.5GHz	DSP, BB2D, IPU, IVA, GPU, VPE	DDR3, SRAM	Yes	-	GbE	SATA 3Gbps (1)	USB 2.0 (1), USB 3.0 (1)	1.8V, 3.3V	-40°C ~ 105°C (TJ)	-	Surface Mount	760-BFBGA, FCBGA	760-FCBGA (23x23)	-
AM5728BABCXEA IC MPU SITARA 1.5GHZ 760FCBGA Texas Instruments	34 In Stock	1 : ¥704.70000 Tray	Sitara™	Tray	Active	ARM® Cortex®-A15	2 Core, 32-Bit	1.5GHz	DSP, BB2D, IPU, IVA, GPU, VPE	DDR3, SRAM	Yes	-	GbE	SATA 3Gbps (1)	USB 2.0 (1), USB 3.0 (1)	1.8V, 3.3V	-40°C ~ 105°C (TJ)	-	Surface Mount	760-BFBGA, FCBGA	760-FCBGA (23x23)	CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
AM5726BABCXA IC MPU SITARA 1.5GHZ 760FCBGA Texas Instruments	113 In Stock	1 : ¥628.52000 Tray	Sitara™	Tray	Active	ARM® Cortex®-A15	2 Core, 32-Bit	1.5GHz	DSP, IPU, VPE	DDR3, SRAM	No	-	GbE	SATA 3Gbps (1)	USB 2.0 (1), USB 3.0 (1)	1.8V, 3.3V	-40°C ~ 105°C (TJ)	-	Surface Mount	760-BFBGA, FCBGA	760-FCBGA (23x23)	-
AM5726BABCXAR IC MPU SITARA 1.5GHZ 760FCBGA Texas Instruments	0 In Stock Check Lead Time	250 : ¥500.39920 Tape & Reel (TR)	Sitara™	Tape & Reel (TR)	Active	ARM® Cortex®-A15	2 Core, 32-Bit	1.5GHz	DSP, IPU, VPE	DDR3, SRAM	No	-	GbE	SATA 3Gbps (1)	USB 2.0 (1), USB 3.0 (1)	1.8V, 3.3V	-40°C ~ 105°C (TJ)	-	Surface Mount	760-BFBGA, FCBGA	760-FCBGA (23x23)	-

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Microprocessors

Microprocessor products are integrated circuits used for information and data processing. They are differentiated from similar products that are considered microcontrollers primarily by the manufacturer's choice of term, though by tradition microprocessors do not integrate working memory within the device, are less likely to integrate mixed-signal peripherals, and likely to be used under more complex software paradigms involving the use of an operating system to manage the concomitant execution of multiple tasks.