Adapter, Breakout Boards

Results: 3
Manufacturer
Adafruit Industries LLCAries ElectronicsChip Quik Inc.
Series
-Correct-A-Chip®Proto-Advantage
Package Accepted
SOICSOIC, TSSOP
Pitch
0.050" (1.27mm)-
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.700" x 0.800" (17.78mm x 20.32mm)0.800" L x 0.700" W (20.32mm x 17.78mm)
Stocking Options
Environmental Options
Media
Marketplace Product
3Results

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of 3
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
1207
1207
SMT ADAPTERS 3 PAK 16SOIC/TSSOP
Adafruit Industries LLC
457
In Stock
1 : ¥32.43000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
16
-
-
-
0.800" L x 0.700" W (20.32mm x 17.78mm)
PA0006
PA0006
SOIC-16 TO DIP-16 SMT ADAPTER
Chip Quik Inc.
499
In Stock
1 : ¥33.58000
Bulk
Bulk
Active
SMD to DIP
SOIC
16
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.800" (17.78mm x 20.32mm)
LCQT-SOIC16
LCQT-SOIC16
SOCKET ADAPTER SOIC TO 16DIP
Aries Electronics
354
In Stock
1 : ¥39.00000
Bulk
Bulk
Active
SMD to DIP
SOIC
16
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.800" L x 0.700" W (20.32mm x 17.78mm)
Showing
of 3

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.