Adapter, Breakout Boards

Results: 12
Manufacturer
Adafruit Industries LLCAries ElectronicsChip Quik Inc.Logical Systems Inc.Schmartboard, Inc.Texas Instruments
Series
-Correct-A-Chip®Proto-Advantage
Packaging
BagBoxBulk
Proto Board Type
SMD to DIPSMD to Plated Through HoleSMD to Plated Through Hole Board
Package Accepted
0805, 1206, 5, 6, 6, B, C, CASE-A, D, D2PAK, DPAK, E, SC70-5, SOT223, SOT23-3, SOT89, TO263-7MSOP, SC70, SOIC, SOT23, SOT563, TSSOPMSOP, SOIC, TSSOPSC-70, SC-88, SOT-363SC-70, SOT-323SOICSOT-23SOT-23, SC-59, SC-74ASOT23TSSOPVSSOP
Number of Positions
35681416-
Pitch
0.020" (0.50mm)0.026" (0.65mm)0.037" (0.95mm)0.050" (1.27mm)-
Board Thickness
0.031" (0.79mm) 1/32"0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.400" L x 0.500" W (10.16mm x 12.70mm)0.400" x 0.300" (10.16mm x 7.62mm)0.400" x 0.700" (10.16mm x 17.78mm)0.500" L x 0.500" W (12.70mm x 12.70mm)0.550" L x 0.425" W (13.97mm x 10.80mm)0.700" x 0.200" (17.78mm x 5.08mm)0.700" x 0.300" (17.78mm x 7.62mm)0.700" x 0.400" (17.78mm x 10.16mm)0.850" L x 0.500" W (21.59mm x 12.70mm)2.000" L x 2.000" W (50.80mm x 50.80mm)-
Stocking Options
Environmental Options
Media
Marketplace Product
12Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
PA0087
PA0087
SC70-6/SOT-363 TO DIP-6 SMT ADAP
Chip Quik Inc.
486
In Stock
1 : ¥22.08000
Bulk
Bulk
Active
SMD to DIP
SC-70, SC-88, SOT-363
6
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.300" (17.78mm x 7.62mm)
LCQT-SOT23-6
LCQT-SOT23-6
SOCKET ADAPTER SOT-23 TO 6DIP
Aries Electronics
1,865
In Stock
1 : ¥23.23000
Bulk
Bulk
Active
SMD to DIP
SOT23
6
0.037" (0.95mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" L x 0.500" W (10.16mm x 12.70mm)
1212
1212
SMT ADAP 6 PACK 8SOIC/MSOP/TSSOP
Adafruit Industries LLC
1,112
In Stock
1 : ¥24.22000
Bulk
-
Bulk
Active
SMD to DIP
MSOP, SOIC, TSSOP
8
-
-
-
0.550" L x 0.425" W (13.97mm x 10.80mm)
LCQT-SOIC8-8
LCQT-SOIC8-8
SOCKET ADAPTER SOIC TO 8DIP
Aries Electronics
6,322
In Stock
1 : ¥24.87000
Bulk
Bulk
Active
SMD to DIP
SOIC
8
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.500" L x 0.500" W (12.70mm x 12.70mm)
pa-sod3sm18-16
PA-SOD3SM18-16
SOCKET ADAPTER SOIC TO 16DIP
Logical Systems Inc.
421
In Stock
1 : ¥65.68000
Box
-
Box
Active
SMD to DIP
SOIC
16
0.050" (1.27mm)
0.031" (0.79mm) 1/32"
-
0.850" L x 0.500" W (21.59mm x 12.70mm)
DIP-ADAPTER-EVM
DIP-ADAPTER-EVM
MODULE EVAL DIP ADAPTER
Texas Instruments
242
In Stock
1 : ¥98.51000
Box
-
Box
Active
SMD to Plated Through Hole
MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
6
-
-
-
-
PCB3007-1
PCB3007-1
SOT23 TO DIP SMT ADAPTER
Chip Quik Inc.
109
In Stock
1 : ¥17.16000
Bulk
Bulk
Active
SMD to DIP
SOT-23
6
0.037" (0.95mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" x 0.300" (10.16mm x 7.62mm)
PA0086
PA0086
SOT23-5/SC59-5/SC-74A TO DIP-6
Chip Quik Inc.
357
In Stock
1 : ¥22.08000
Bulk
Bulk
Active
SMD to DIP
SOT-23, SC-59, SC-74A
5
0.037" (0.95mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.300" (17.78mm x 7.62mm)
PA0042
PA0042
VSSOP-8 TO DIP-8 SMT ADAPTER
Chip Quik Inc.
451
In Stock
1 : ¥26.19000
Bulk
Bulk
Active
SMD to DIP
VSSOP
8
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.400" (17.78mm x 10.16mm)
PCB3008-1
PCB3008-1
TSSOP-14 TO DIP-14 SMT ADAPTER
Chip Quik Inc.
398
In Stock
1 : ¥26.19000
Bulk
Bulk
Active
SMD to DIP
TSSOP
14
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" x 0.700" (10.16mm x 17.78mm)
PA0082
PA0082
SC70-3/SOT-323 TO DIP-4 SMT ADAP
Chip Quik Inc.
72
In Stock
1 : ¥22.08000
Bulk
Bulk
Active
SMD to DIP
SC-70, SOT-323
3
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.200" (17.78mm x 5.08mm)
202-0035-01
202-0035-01
EZ DISCRETE #2 SUPPORTS SOT23-3,
Schmartboard, Inc.
19
In Stock
1 : ¥82.10000
Bag
-
Bag
Active
SMD to Plated Through Hole Board
0805, 1206, 5, 6, 6, B, C, CASE-A, D, D2PAK, DPAK, E, SC70-5, SOT223, SOT23-3, SOT89, TO263-7
-
-
-
-
2.000" L x 2.000" W (50.80mm x 50.80mm)
Showing
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Adapter, Breakout Boards

Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.