Adapter, Breakout Boards

Results: 5
Manufacturer
Adafruit Industries LLCChip Quik Inc.
Series
-Proto-Advantage
Proto Board Type
SMD to DIPSMD to Plated Through Hole Board
Package Accepted
FPCFPC Connector
Number of Positions
1020304050
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.900" x 0.550" (22.86mm x 13.97mm)0.900" x 1.550" (22.86mm x 39.37mm)0.900" x 2.050" (22.86mm x 52.07mm)2.002" L x 0.550" W (50.85mm x 13.98mm)2.506" L x 1.011" W (63.66mm x 25.68mm)
Stocking Options
Environmental Options
Media
Marketplace Product
5Results

Showing
of 5
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
1325
1325
FPC STICK 20PIN 0.5/1MM ADAPTER
Adafruit Industries LLC
200
In Stock
1 : ¥16.01000
Bulk
-
Bulk
Active
SMD to Plated Through Hole Board
FPC
20
-
-
-
2.002" L x 0.550" W (50.85mm x 13.98mm)
MFG_1492
1492
FPC ADAPTER 50PIN 0.5MM PITCH
Adafruit Industries LLC
217
In Stock
1 : ¥24.22000
Bulk
-
Bulk
Active
SMD to Plated Through Hole Board
FPC
50
0.020" (0.50mm)
-
-
2.506" L x 1.011" W (63.66mm x 25.68mm)
FPC050P010
FPC050P010
FPC/FFC SMT CONN .5MM PITCH 10PI
Chip Quik Inc.
406
In Stock
1 : ¥30.29000
Bulk
Bulk
Active
SMD to DIP
FPC Connector
10
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.900" x 0.550" (22.86mm x 13.97mm)
FPC050P030
FPC050P030
FPC/FFC SMT CONNECTOR 0.5 MM PIT
Chip Quik Inc.
148
In Stock
1 : ¥47.53000
Bulk
Bulk
Active
SMD to DIP
FPC Connector
30
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.900" x 1.550" (22.86mm x 39.37mm)
FPC050P040
FPC050P040
FPC/FFC SMT CONNECTOR 0.5 MM PIT
Chip Quik Inc.
75
In Stock
1 : ¥56.57000
Bulk
Bulk
Active
SMD to DIP
FPC Connector
40
0.020" (0.50mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.900" x 2.050" (22.86mm x 52.07mm)
Showing
of 5

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.