Adapter, Breakout Boards

Results: 12
Manufacturer
Adafruit Industries LLCAries ElectronicsChip Quik Inc.
Series
-Correct-A-Chip®Correct-A-Chip® 350000Proto-Advantage
Packaging
BulkTube
Package Accepted
SC70-6SOICSOIC, SOPSOIC, TSSOPTSSOP
Number of Positions
68141628
Pitch
0.026" (0.65mm)0.050" (1.27mm)-
Board Thickness
0.062" (1.57mm) 1/16"0.063" (1.60mm)-
Material
-FR4 Epoxy Glass
Size / Dimension
0.400" L x 0.300" W (10.16mm x 7.62mm)0.400" L x 0.400" W (10.16mm x 10.16mm)0.400" x 0.700" (10.16mm x 17.78mm)0.700" L x 0.400" W (17.78mm x 10.16mm)0.700" L x 0.450" W (17.78mm x 11.43mm)0.700" L x 0.700" W (17.78mm x 17.78mm)0.700" x 0.400" (17.78mm x 10.16mm)0.700" x 0.700" (17.78mm x 17.78mm)0.800" L x 0.400" W (20.32mm x 10.16mm)0.800" x 1.400" (20.32mm x 35.56mm)
Stocking Options
Environmental Options
Media
Marketplace Product
12Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
PA0001C
PA0001C
SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Chip Quik Inc.
1,143
In Stock
1 : ¥53.28000
Bulk
Bulk
Active
SMD to DIP
SOIC
8
0.050" (1.27mm)
0.063" (1.60mm)
FR4 Epoxy Glass
0.400" L x 0.400" W (10.16mm x 10.16mm)
14-350000-11-RC
14-350000-11-RC
SOCKET ADAPTER SOIC TO 14DIP 0.3
Aries Electronics
758
In Stock
1 : ¥173.47000
Tube
Tube
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.450" W (17.78mm x 11.43mm)
PCB3008-1
PCB3008-1
TSSOP-14 TO DIP-14 SMT ADAPTER
Chip Quik Inc.
401
In Stock
1 : ¥26.19000
Bulk
Bulk
Active
SMD to DIP
TSSOP
14
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" x 0.700" (10.16mm x 17.78mm)
PCB3001-1
PCB3001-1
SOIC28W/N AND SOP28 TO DIP SMT A
Chip Quik Inc.
196
In Stock
1 : ¥26.19000
Bulk
Bulk
Active
SMD to DIP
SOIC, SOP
28
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.800" x 1.400" (20.32mm x 35.56mm)
PA0003
PA0003
SOIC-14 TO DIP-14 SMT ADAPTER
Chip Quik Inc.
244
In Stock
1 : ¥28.65000
Bulk
Bulk
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.700" (17.78mm x 17.78mm)
PA0002
PA0002
SOIC-8 TO DIP-8 SMT ADAPTER
Chip Quik Inc.
158
In Stock
1 : ¥28.65000
Bulk
Bulk
Active
SMD to DIP
SOIC
8
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.400" (17.78mm x 10.16mm)
LCQT-SOIC14W
LCQT-SOIC14W
SOCKET ADAPTER SOIC-W TO 14DIP
Aries Electronics
188
In Stock
1 : ¥37.11000
Bulk
Bulk
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.700" W (17.78mm x 17.78mm)
1210
1210
SMT ADAPTERS 6 PACK 14SOIC/TSSOP
Adafruit Industries LLC
219
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
SMD to DIP
SOIC, TSSOP
14
-
-
-
0.700" L x 0.700" W (17.78mm x 17.78mm)
PA0033C
PA0033C
TSSOP-14 TO DIP-14 SMT ADAPTER (
Chip Quik Inc.
116
In Stock
1 : ¥54.92000
Bulk
Bulk
Active
SMD to DIP
TSSOP
14
0.026" (0.65mm)
0.063" (1.60mm)
FR4 Epoxy Glass
0.700" L x 0.400" W (17.78mm x 10.16mm)
14-350000-10
14-350000-10
SOCKET ADAPTER SOIC TO 14DIP 0.3
Aries Electronics
343
In Stock
1 : ¥154.26000
Tube
Tube
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.450" W (17.78mm x 11.43mm)
PA0087C
PA0087C
SC70-6 TO DIP-6 SMT ADAPTER (0.6
Chip Quik Inc.
49
In Stock
1 : ¥46.71000
Bulk
Bulk
Active
SMD to DIP
SC70-6
6
0.026" (0.65mm)
0.063" (1.60mm)
FR4 Epoxy Glass
0.400" L x 0.300" W (10.16mm x 7.62mm)
PA0005C
PA0005C
SOIC-16 TO DIP-16 SMT ADAPTER (1
Chip Quik Inc.
0
In Stock
Check Lead Time
1 : ¥58.21000
Bulk
Bulk
Active
SMD to DIP
SOIC
16
0.050" (1.27mm)
0.063" (1.60mm)
FR4 Epoxy Glass
0.800" L x 0.400" W (20.32mm x 10.16mm)
Showing
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Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.