SDL-108-G-11 | |
---|---|
DigiKey Part Number | SAM1134-08-ND |
Manufacturer | |
Manufacturer Product Number | SDL-108-G-11 |
Description | CONN RCPT 16POS 0.1 GOLD PCB |
Customer Reference | |
Detailed Description | 16 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold |
Datasheet | Datasheet |
EDA/CAD Models | SDL-108-G-11 Models |
Type | Description | Select All |
---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Tube | |
Part Status | Discontinued at Digi-Key | |
Connector Type | ||
Contact Type | Female Socket | |
Style | Board to Board | |
Number of Positions | ||
Number of Positions Loaded | All | |
Pitch - Mating | ||
Number of Rows | 2 | |
Row Spacing - Mating | 0.100" (2.54mm) | |
Mounting Type | Through Hole | |
Termination | ||
Fastening Type | Push-Pull | |
Contact Finish - Mating | ||
Contact Finish Thickness - Mating | 30.0µin (0.76µm) | |
Insulation Color | Black | |
Insulation Height | 0.132" (3.35mm) | |
Contact Length - Post | 0.108" (2.75mm) | |
Operating Temperature | -55°C ~ 125°C | |
Material Flammability Rating | - | |
Contact Finish - Post | Gold | |
Mated Stacking Heights | - | |
Ingress Protection | - | |
Features | - | |
Current Rating (Amps) | - | |
Voltage Rating | - | |
Applications | - | |
Insulation Material | Liquid Crystal Polymer (LCP) | |
Contact Shape | Circular | |
Contact Material | Beryllium Copper | |
Contact Finish Thickness - Post | 10.0µin (0.25µm) | |
Base Product Number |
![](http://mm.digikey.com/Volume0/opasdata/d220001/derivates/3/002/356/478/SDL-102-G-11_tmb.jpg)
![](http://mm.digikey.com/Volume0/opasdata/d220001/derivates/3/002/356/478/SDL-102-G-11_tmb.jpg)
![](http://mm.digikey.com/Volume0/opasdata/d220001/derivates/3/002/302/778/SDL-104-G-11_tmb.jpg)
![](http://mm.digikey.com/Volume0/opasdata/d220001/derivates/3/002/376/397/SDL-1xx-G-11_tmb.jpg)
![](http://mm.digikey.com/Volume0/opasdata/d220001/derivates/3/002/376/397/SDL-1xx-G-11_tmb.jpg)