HF115AC-0.0055-AC-58 is out of stock and can be placed on backorder.
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Laird Technologies - Thermal Materials
In Stock: 25
Unit Price: ¥411.76000
Datasheet

HF115AC-0.0055-AC-58

DigiKey Part Number
BER168-ND
Manufacturer
Manufacturer Product Number
HF115AC-0.0055-AC-58
Description
THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Customer Reference
Detailed Description
Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Bergquist
Series
Packaging
Bulk
Part Status
Active
Usage
TO-220
Type
Pad, Sheet
Shape
Rectangular
Outline
19.05mm x 12.70mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
All prices are in CNY
Bulk
QuantityUnit Price
(Including 13% VAT)
Ext Price
(Including 13% VAT)
1¥7.47000¥7.47
10¥6.66000¥66.60
50¥5.97420¥298.71
100¥5.28470¥528.47
500¥4.59558¥2,297.79
1,000¥3.44668¥3,446.68
5,000¥2.98712¥14,935.60
Manufacturers Standard Package