Bipolar Transistor Arrays

Results: 2
Manufacturer
onsemiRohm Semiconductor
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Transistor Type
2 NPN (Dual)2 PNP (Dual)
Current - Collector (Ic) (Max)
100mA150mA
Voltage - Collector Emitter Breakdown (Max)
50V65V
Vce Saturation (Max) @ Ib, Ic
500mV @ 5mA, 50mA600mV @ 5mA, 100mA
Current - Collector Cutoff (Max)
15nA (ICBO)100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce
120 @ 1mA, 6V200 @ 2mA, 5V
Power - Max
150mW380mW
Frequency - Transition
100MHz140MHz
Operating Temperature
-55°C ~ 150°C (TJ)150°C (TJ)
Supplier Device Package
SC-88/SC70-6/SOT-363UMT6
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Transistor Type
Current - Collector (Ic) (Max)
Voltage - Collector Emitter Breakdown (Max)
Vce Saturation (Max) @ Ib, Ic
Current - Collector Cutoff (Max)
DC Current Gain (hFE) (Min) @ Ic, Vce
Power - Max
Frequency - Transition
Operating Temperature
Grade
Qualification
Mounting Type
Package / Case
Supplier Device Package
UMT6
UMT1NFHATN
PNP+PNP GENERAL PURPOSE AMPLIFIC
Rohm Semiconductor
5,222
In Stock
1 : ¥3.86000
Cut Tape (CT)
3,000 : ¥0.84602
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
2 PNP (Dual)
150mA
50V
500mV @ 5mA, 50mA
100nA (ICBO)
120 @ 1mA, 6V
150mW
140MHz
150°C (TJ)
Automotive
AEC-Q101
Surface Mount
6-TSSOP, SC-88, SOT-363
UMT6
SOT-363
NSVT65011MW6T1G
TRANS 2NPN 65V 0.1A SC88-6
onsemi
29,978
In Stock
1 : ¥3.78000
Cut Tape (CT)
3,000 : ¥0.83267
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
2 NPN (Dual)
100mA
65V
600mV @ 5mA, 100mA
15nA (ICBO)
200 @ 2mA, 5V
380mW
100MHz
-55°C ~ 150°C (TJ)
-
-
Surface Mount
6-TSSOP, SC-88, SOT-363
SC-88/SC70-6/SOT-363
Showing
of 2

Bipolar Transistor Arrays


Bipolar transistor arrays incorporate two or more discrete transistors in a shared package, either as electrically separate entities or with interconnections of some form between them being made inside the device package. Arrays in which the devices contained have closely matched or complementary characteristics, the co-packaged character minimizes temperature differences between devices during operation.