Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension

1325 FPC STICK 20PIN 0.5/1MM ADAPTER Adafruit Industries LLC	225 In Stock	1 : ¥16.01000 Bulk	-	Bulk	Active	SMD to Plated Through Hole Board	FPC	20	-	-	-	2.002" L x 0.550" W (50.85mm x 13.98mm)
FPC050P010 FPC/FFC SMT CONN .5MM PITCH 10PI Chip Quik Inc.	406 In Stock	1 : ¥30.29000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	FPC Connector	10	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.900" x 0.550" (22.86mm x 13.97mm)
FPC050P030 FPC/FFC SMT CONNECTOR 0.5 MM PIT Chip Quik Inc.	148 In Stock	1 : ¥47.53000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	FPC Connector	30	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.900" x 1.550" (22.86mm x 39.37mm)
1436 FPC ADAPT 40PIN .5/.6/.7/.8/1MM Adafruit Industries LLC	41 In Stock	1 : ¥40.64000 Bulk	-	Bulk	Active	SMD to Plated Through Hole Board	FPC	40	-	-	-	2.300" L x 2.190" W (58.46mm x 55.86mm)
NDR050D254P040 NARROW DUAL ROW 0.5MM PITCH 40-P Chip Quik Inc.	36 In Stock	1 : ¥56.57000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	0.5mm Connector	40	0.020" (0.50mm)	-	FR4 Epoxy Glass	2.000" L x 1.000" W (50.80mm x 25.40mm)
FPC050P050 FPC/FFC SMT CONNECTOR 0.5 MM PIT Chip Quik Inc.	43 In Stock	1 : ¥64.78000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	FPC Connector	50	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.900" x 2.550" (22.86mm x 64.77mm)
FPC050P060ST FPC/FFC SMT CONNECTOR (0.5 MM PI Chip Quik Inc.	7 In Stock	1 : ¥98.44000 Bulk	Proto-Advantage	Bulk	Active	Connector to DIP	FFC/FPC Connector	60	0.020" (0.50mm)	-	-	-
GEN-DR080-P40 GENERIC DUAL ROW 0.80MM PITCH 40 Chip Quik Inc.	12 In Stock	1 : ¥82.02000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	0.8mm Connector	40	0.031" (0.80mm)	-	FR4 Epoxy Glass	2.000" L x 1.000" W (50.80mm x 25.40mm)

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Adapter, Breakout Boards

Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.