Adapter, Breakout Boards

Results: 4
Manufacturer
Adafruit Industries LLCSaiko Systems Ltd.SparkFun Electronics
Packaging
BoxBulk
Proto Board Type
Connector to Plated Through HoleConnector to SIPConnector to SMD
Package Accepted
USB - CUSB - C Receptacle
Number of Positions
46726
Pitch
0.100" (2.54mm)-
Board Thickness
0.062" (1.57mm) 1/16"0.100" (2.54mm) 1/10"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.600" L x 0.400" W (15.24mm x 10.16mm)0.800" L x 0.450" W (20.32mm x 11.43mm)0.870" L x 0.550" W (22.10mm x 14.00mm)1.720" L x 1.100" W (43.69mm x 27.94mm)
Stocking Options
Environmental Options
Media
Marketplace Product
4Results

Showing
of 4
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
699
In Stock
1 : ¥40.64000
Bulk
-
Bulk
Active
Connector to SIP
USB - C
6
0.100" (2.54mm)
-
-
0.870" L x 0.550" W (22.10mm x 14.00mm)
5180
5180
SIMPLE USB C SOCKET BREAKOUT
Adafruit Industries LLC
525
In Stock
1 : ¥14.37000
Bulk
-
Bulk
Active
Connector to SIP
USB - C
4
-
0.100" (2.54mm) 1/10"
-
0.600" L x 0.400" W (15.24mm x 10.16mm)
BRK-USB-CV2.0
BRK-USB-CV2.0
USB TYPE C FEMALE RECEPTACLE BRE
Saiko Systems Ltd.
324
In Stock
1 : ¥86.61000
Bulk
-
Bulk
Active
Connector to Plated Through Hole
USB - C Receptacle
26
0.100" (2.54mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
1.720" L x 1.100" W (43.69mm x 27.94mm)
BOB-23055
BOB-23055
USB-C BREAKOUT - VERTICAL
SparkFun Electronics
96
In Stock
1 : ¥40.64000
Box
-
Box
Active
Connector to SMD
USB - C
7
0.100" (2.54mm)
-
-
0.800" L x 0.450" W (20.32mm x 11.43mm)
Showing
of 4

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.