Heat Sinks

Results: 2
Manufacturer
Assmann WSW ComponentsCTS Thermal Management Products
Series
-APF
Packaging
BoxBulk
Attachment Method
-Thermal Tape, Adhesive (Included)
Shape
Square, FinsSquare, Pin Fins
Length
0.394" (10.00mm)1.575" (40.00mm)
Width
0.394" (10.00mm)1.575" (40.00mm)
Fin Height
0.250" (6.35mm)0.275" (7.00mm)
Thermal Resistance @ Forced Air Flow
3.30°C/W @ 200 LFM-
Thermal Resistance @ Natural
31.00°C/W-
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V2017B
V2017B
HEATSINK ANOD ALUM CPU
Assmann WSW Components
6,070
In Stock
1 : ¥4.52000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
-
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
-
-
31.00°C/W
Aluminum
Black Anodized
47
In Stock
1 : ¥63.79000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.250" (6.35mm)
-
3.30°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.