Heat Sinks

Results: 9
Manufacturer
Boyd Laconia, LLCOhmiteWakefield-Vette
Series
-CC2PenguinVMWWC
Packaging
BagBoxBulkTray
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)TO-220TO-220, TO-247TO-220, TO-247, TO-264TO-247TO-263 (D²Pak)
Attachment Method
Bolt On and PC PinClip and PC PinSMD PadSolderable FeetThermal Tape, Adhesive (Included)
Shape
Rectangular, FinsSquare, Fins
Length
0.650" (16.51mm)0.763" (19.38mm)0.803" (20.40mm)0.984" (25.00mm)1.201" (30.50mm)1.260" (32.00mm)1.500" (38.10mm)1.520" (38.61mm)1.820" (46.23mm)
Width
0.640" (16.26mm)0.653" (16.59mm)0.720" (18.29mm)0.921" (23.40mm)1.000" (25.40mm)1.339" (34.00mm)1.500" (38.10mm)1.650" (41.91mm)2.362" (60.00mm)
Fin Height
0.350" (8.89mm)0.450" (11.43mm)0.630" (16.00mm)0.640" (16.26mm)0.710" (18.03mm)0.984" (25.00mm)1.260" (32.00mm)1.512" (38.40mm)
Power Dissipation @ Temperature Rise
1.0W @ 20°C2.0W @ 30°C3.0W @ 50°C5.0W @ 60°C10.0W @ 50°C-
Thermal Resistance @ Forced Air Flow
0.60°C/W @ 600 LFM3.00°C/W @ 300 LFM5.00°C/W @ 200 LFM6.00°C/W @ 350 LFM8.00°C/W @ 500 LFM-
Thermal Resistance @ Natural
2.80°C/W11.00°C/W12.00°C/W16.80°C/W-
Material
AluminumCeramicCopper
Material Finish
-Black AnodizedDegreasedTin
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
11,986
In Stock
1 : ¥16.83000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
WA-T220-101E
WA-T220-101E
HEATSINK AND CLIP FOR TO-220 BLK
Ohmite
8,355
In Stock
1 : ¥18.55000
Tray
Tray
Active
Board Level, Vertical
TO-220
Clip and PC Pin
Rectangular, Fins
1.201" (30.50mm)
0.720" (18.29mm)
-
0.630" (16.00mm)
1.0W @ 20°C
-
12.00°C/W
Aluminum
Black Anodized
WA-T247-101E
WA-T247-101E
HEATSINK AND CLIP FOR TO-247 BLK
Ohmite
11,792
In Stock
1 : ¥21.26000
Tray
Tray
Active
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
1.260" (32.00mm)
0.921" (23.40mm)
-
0.630" (16.00mm)
1.0W @ 20°C
8.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
7109DG
7109DG
TOP MOUNT HEATSINK .45" D2PAK
Boyd Laconia, LLC
4,668
In Stock
1 : ¥27.91000
Bag
-
Bag
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
2.0W @ 30°C
3.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
VM SERIES
VM1-038-1AE
HEATSINK VERTICAL
Ohmite
1,632
In Stock
1 : ¥28.32000
Bulk
Bulk
Active
Board Level, Vertical
TO-220, TO-247
Solderable Feet
Rectangular, Fins
1.520" (38.61mm)
2.362" (60.00mm)
-
0.984" (25.00mm)
10.0W @ 50°C
0.60°C/W @ 600 LFM
-
Aluminum
Black Anodized
C247-025-1VE
C247-025-1VE
HEATSINK FOR TO-247 WITH 1 CLIP
Ohmite
1,339
In Stock
1 : ¥19.05000
Box
Box
Active
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.500" (38.10mm)
-
0.710" (18.03mm)
5.0W @ 60°C
6.00°C/W @ 350 LFM
-
Aluminum
Degreased
C2A-XT4-46E
C2A-XT4-46E
ALUMINUM HEATSINK 46MM BLK ANODI
Ohmite
88
In Stock
1 : ¥39.90000
Box
Box
Active
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
1.820" (46.23mm)
1.650" (41.91mm)
-
1.260" (32.00mm)
-
-
2.80°C/W
Aluminum
Black Anodized
581102B02500(G)
581102B02500G
HEATSINK TO-220 2.5W BLK W/PINS
Boyd Laconia, LLC
0
In Stock
1 : ¥14.29000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
0.640" (16.26mm)
-
0.640" (16.26mm)
3.0W @ 50°C
5.00°C/W @ 200 LFM
16.80°C/W
Aluminum
Black Anodized
WC-T2X-38E
WC-T2X-38E
CERAMIC HEATSINK WITH CLIP
Ohmite
0
In Stock
Check Lead Time
1 : ¥62.39000
Tray
Tray
Active
Board Level, Vertical
TO-220, TO-247, TO-264
Clip and PC Pin
Rectangular, Fins
0.803" (20.40mm)
1.339" (34.00mm)
-
1.512" (38.40mm)
-
-
12.00°C/W
Ceramic
-
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Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.