Single Diodes

Results: 2
Manufacturer
GeneSiC SemiconductorSTMicroelectronics
Series
-SiC Schottky MPS™
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SiC (Silicon Carbide) SchottkyStandard
Current - Average Rectified (Io)
1A2.5A
Voltage - Forward (Vf) (Max) @ If
1.8 V @ 1 A1.9 V @ 1 A
Speed
Fast Recovery =< 500ns, > 200mA (Io)No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr)
0 ns75 ns
Current - Reverse Leakage @ Vr
5 µA @ 1200 V10 µA @ 1200 V
Capacitance @ Vr, F
69pF @ 1V, 1MHz-
Supplier Device Package
DO-214AA (SMB)SMB
Operating Temperature - Junction
-55°C ~ 175°C175°C (Max)
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
DO-214AA
STTH112U
DIODE GEN PURP 1.2KV 1A SMB
STMicroelectronics
17,769
In Stock
1 : ¥3.53000
Cut Tape (CT)
2,500 : ¥0.95634
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Standard
1200 V
1A
1.9 V @ 1 A
Fast Recovery =< 500ns, > 200mA (Io)
75 ns
5 µA @ 1200 V
-
Surface Mount
DO-214AA, SMB
SMB
175°C (Max)
DO-214AA, SMB
GB01SLT12-214
DIODE SIL CARBIDE 1.2KV 2.5A SMB
GeneSiC Semiconductor
12,092
In Stock
1 : ¥21.10000
Cut Tape (CT)
3,000 : ¥13.79198
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
SiC (Silicon Carbide) Schottky
1200 V
2.5A
1.8 V @ 1 A
No Recovery Time > 500mA (Io)
0 ns
10 µA @ 1200 V
69pF @ 1V, 1MHz
Surface Mount
DO-214AA, SMB
DO-214AA (SMB)
-55°C ~ 175°C
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Single Diodes


Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.