Winbond Memory for Automotive Solution
Winbond Memory for Automotive Solution

Winbond brings you high quality and high performance for these automotive-grade memory solutions, including Mobile DRAM, Specialty DRAM, Code Storage Flash and TrustME Secure Flash.

Winbond HYPERRAM™ - Best DRAM Choice for AIoT Application

Winbond’s HYPERRAM™ is optimized for the growing AIoT applications including transportation, factories, and smart home. HYPERRAM provides design simplicity, space saving, and low power operation while delivering the performance needed.

Winbond High Performance Serial NAND & OctalNAND Flash

Winbond High Performance Serial NAND (QspiNAND) offers reliable, lower-cost alternative to SPI NOR Flash in 1Gbit and 2Gbit capacities with a maximum data transfer rate of 166MB/s for automotive displays and instrument clusters.

Why Stacked Die? Winbond SpiStack® Flash
Why Stacked Die? Winbond SpiStack® Flash

Winbond’s SpiStack® W25M Memory Series for “stacking” of homogeneous or heterogeneous flash, thus achieving memories of varying densities for code and data storage, while providing designers with flash solutions for their design requirements.

DRAM Memories Products

Specialty DRAM & Mobile DRAM.

快速实现无云连接的防欺骗人脸识别 发布日期：2021-02-24

专用处理器和软件库为基于人脸的身份验证提供了一个更简单、更安全的选择。

增加持续 Wi-Fi 连接而不影响电池续航时间 发布日期：2020-09-24

设计人员可以使用无线 SoC 的专用电源管理技术，以最小的电流水平支持持续 Wi-Fi 连接。

Image of Winbond SDR, DDR, DDR2, DDR3, and Mobile DRAM Products 专用 DRAM 和移动 DRAM 产品 更新日期： 2020-05-22

Winbond 是全球最主要 DRAM 供应商之一，专注于嵌入式设计和移动市场。

Image of Winbond's W25Q512JV 512 Mb Serial Flash Memory W25Q512JV 512 Mb 串行闪存 发布日期：2019-12-03

Winbond 的 W25Q512JV (512 Mb) 串行闪存为有限空间、引脚数和功能的系统提供了一种存储解决方案。

Winbond Electronics Serial Flash Memory Part 1: SPI Interface Serial Flash Memory Part 1: SPI Interface 发布日期：2019-10-28

This presentation will review the operation, performance and use cases for serial flash interfaces while concentrating on Serial Peripheral Interface or SPI.

Duration: 5 minutes
使用低成本模块和 MicroPython 快速构建基于 AI 的视觉和听觉设备 发布日期：2019-08-01

借助 MicroPython 和神经网络处理模块，开发人员可以快速实现基于机器学习的语音和对象识别设计。

SDRAM-SM SDRAM Memory Basic Introduction 发布日期：2018-07-23

This presentation will highlight Winbond’s SDRAM Memory Basic Introduction.

Duration: 10 minutes
设计适用于工业 IoT 的稳健的系统 发布日期：2018-01-25

工业 IoT 要求设计人员特别注意架构、设备可靠性和稳健性及连接性。

Image of Winbond's W25N QspiNAND Flash W25N QspiNAND 闪存 发布日期：2017-01-25

Winbond 的 SLC NAND 闪存产品是业内不同供应商的 ONFi SLC NAND 产品的直接替代品，这些产品相互兼容。

Image of Winbond W25 spiFlash Series W25 SpiFlash® 系列 发布日期：2017-01-25

Winbond W25X 和 W25Q SpiFlash® 多 I/O 存储器具有常见的串行外设接口 (SPI)、小型可擦除扇区和业内最高的性能，密度为 512 Kb 至 512 Mb。

Managing Multi-Standard Connectivity Requirements in IoT Designs 发布日期：2016-05-04

IoT apps demand connectivity straddling both industrial and consumer communications requirements. Multi-standard wireless MCUs now offer more these options.

Serial Look Up Tables for Sensors Save Space and Improve Accuracy 发布日期：2013-07-18

Analog transducers and sensors do a good job of translating a real world physical condition into an electronic signal that we can measure and use.

Winbond America Expands Digi-Key Distribution Agreement to Include Europe 发布日期：2006-10-03

Digi-Key Corporation and Winbond Electronics Corporation America announce the expansion of the companies' current distribution agreement to include Europe.

Image of Winbond Electronics color logo Winbond Electronics Corporation

Winbond Electronics Corporation America (WECA) 成立于 1990 年。该公司是 Winbond Electronics Corporation 的销售、市场和设计部门，总部位于中国台湾新竹的科技工业园。