Additional features are shown on this slide. 16 nm low-power FinFET+ process technology from TSMC delivers over two-times performance-per-watt compared to Kintex®-7 FPGAs. Hardened connections enable cascading between adjacent block RAMs, providing an easy method to create large, fast memory arrays and FIFOs. UltraRAM is a high-density, dual-port, synchronous on-chip memory available in UltraScale+™ devices. Cascadable and flexible, UltraRAM offers the possibility to reduce BOM cost. Kintex UltraScale+ offers massive memory interface bandwidth with DDR4 support of up to 2,666 Mb/s. Support for server-class DIMMs enables eight-times the capacity compared to Kintex-7. SmartConnect technology addresses the system interconnect bottleneck challenge by optimizing AXI interconnect networks for performance and area.