Artix^®-7 offers one of the smallest form factor packaging for 17,000 to 215,000 logic cells, having higher I/O count and total bandwidth, while also saving on board space and cost. There is isolation of high range and high density I/Os. The packaging is optimized for low cost 2-layer PCBs using large via sizes. It is lower cost than traditional FT256 packages with similar I/O counts. Thanks to footprint-compatible packaging, it is possible to easily migrate to larger or smaller density in the same footprint.