This simplified process flow diagram illustrates the construction of Vishay Barry’s thick-film RF power resistors. The resistors are built on a substrate of either BeO, AlN, or alumina on which a layer of resistive thick film is deposited, baked in an oven, and trimmed to the resistance value ordered by the customer. The chip can then be terminated to produce a surface-mount chip resistor, or ribbon-leads may be added to make a leaded resistor. To produce a leaded resistor, the ribbon leads are soldered to the substrate and then a cover is applied to protect the resistive film. A flange-mount resistor may be constructed by mounting the leaded resistor onto a silver-plated copper flange with a thermal interface material, which is chosen depending on the ceramic substrate being used. Finally, the resistor is QA tested, packaged, and shipped.