In summary, PH3 is a thin, copper based heat-spreader that provides a low total cost of ownership solution to many thermal challenges. PH3 is especially useful where restricted space precludes the use of conventional heat-sinks. When used correctly the PH3 can produce a drop in junction temperature of 10 – 20°C. The PH3 uses a high strength acrylic pressure sensitive adhesive for attachment to provide a strong bond to a component while the pliable nature of the PH3 allows conformance to non-flat surfaces for optimal thermal and mechanical performance.