If used correctly, the PH3 can be used to give a component junction temperature reduction of 10 - 20°C. PH3 is designed for ease of use. It can be supplied in custom shapes for complex designs, offers a low profile form factor for enhanced flexibility, comes with a unique pressure sensitive adhesive suitable for almost all surfaces including packages with residual silicon mould release agents present, and can be applied with low pressure to ensure delicate components will not be damaged. Furthermore, the pliable nature of PH3 means that it will conform to almost any surface, even those that are not perfectly flat. Overall, the PH3 offers a low-cost of ownership, high value solution to a wide range of thermal cooling applications.