Thermal interface surfaces of the component and heat sink typically are irregular, either on a gross or a microscopic scale. When the interfaces surfaces are mated, pockets or void spaces develop between them in which air may become entrapped. These pockets reduce the overall surface area contact within the interface, which reduces the heat transfer area and the overall efficiency of the heat transfer through the interface. As air is a relatively poor thermal conductor, the presence of air pockets within the interface reduces the rate of thermal transfer through the interface. To improve the heat transfer efficiency through the interface, a layer of a thermally conductive, electrically-insulating material is interposed between the heat sink and electronic component to fill in any surface irregularities and eliminate air pockets. T-Globals Li98 range of thermally conductive adhesive tapes are halogen-free pressure-sensitive adhesive composition which can be used to address these issues and attach heatsinks to LEDs and provide both mechanical attachment and low thermal resistance. These tapes are tacky pressure sensitive adhesives loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates. Only pressure is needed to form an excellent bond and thermal interface. Furthermore, as these materials can be used to remove screws and clips the cost of ownership is reduced significantly.