This range of high adhesion thermal tapes offers efficient thermal transfer for a wide range of applications requiring a thermal management solution such as bonding heat sinks, heat spreaders and other cooling devices to IC packages, power transistors, and other heat generating components. Each tape in this range combines high performance adhesive with highly conductive ceramic particles for an extremely reliable and user-friendly thermal interface. Highly conformable construction provides excellent wet-out on surfaces. LI98 double-sided thermal interface tapes provide exceptional bonding properties between electronic components and heat sinks, eliminating the need for mechanical fasteners. LI98 has excellent thermal conductivity, high bond strength, and high lap shear strength. This range is commonly used where attachment and thermal management is necessary. Examples include mounting heat sinks to components, attachment of motor control units, and telecom units.