The LFPAK88 comes with all the known LFPAK benefits. Board level reliability, sometimes called “temperature cycling on board”, being one of these. The LFPAK package allows for thermal expansion when module temperature fluctuates during operation, especially in thermally demanding applications. This is unlike QFN packages which do not allow for any movement, meaning cracks in the solder joints potentially result in electrical failures. Seen in the image here is one of the LFPAK88 gull-wing pins, with no solder degradation at 5,000 hours. All 60 devices tested passed to 6,300 hours without failure.