Industry Standard packages and footprint allow density migration without costly PCB re-layout. ISSI SPI flash products maintain a consistent footprint to allow compatibility when memory requirements change. USON 2 x 3 mm offers the smallest available package for space sensitive applications and packages such as VVSOP and WSON offer decreased package height. Common packages such as SOIC-8, support 256 Kb to 128 Mb, and offer customers a quick way to increase or decrease memory usage without costly board re-layout.