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Package Design Characteristics Image of Cornell Dubilier Electronics' (CDE) DSM Package Design

All the modules in the DSM series share similar package design characteristics. This visual illustrates the three basic form factors for the 9, 18, and 30 V modules. Each module is shrink-wrapped and is prewired with twisted-pair wire leads and a standard Molex Mini-Lock power connector. Vertically-mounted cells minimize board space requirements.

PTM Published on: 2023-08-18