Inside the isoPower wide SO-16 package are multiple die; this creates the isolation barrier and integrates the power and isolated data channels. Separating the primary and secondary sides is an isolation barrier built into the package through the use of a split paddle that the die are attached to. Encapsulating the whole assembly is a mold compound, rated for a CTI material class 2, that provides isolation between the primary and secondary sides. Users can see the larger power transformers at the top middle of the package and the data channel transformers at the bottom. On either side of the transformer coils are the control circuitry and transceiver circuitry, built in standard CMOS circuitry, which enable many functions to be integrated in the same package along with isolated DC to DC power. In this example, four channels of data isolation are integrated.