In summary, Amphenol Industrial’s RADSOK® Power-to-Board solutions offer options for high current single-point connections with a compact footprint design that can supply up to 120 A to the board. The hyperbolic grid contact provides more surface area with many points of contact for heat dissipation at the pin and socket interface. This lowers temperature rise and reduces potential failures. RADSOK Power-to-Board products are designed to be applied manually by press-fit or by a re-flow solder process eliminating the need for additional wires and/or special crimp tools.