RADSOK Power to Board

This presentation will cover the RADSOK Power to Board offering of interconnects that are designed for the demanding requirements of the server and related environments. Made up of the RADSERT, POWERBLOK, and PGY, each has a high current single-point connection with a compact footprint design that can supply up to 120 A to the board. The hyperbolic grid contact provides more surface area with many points of contact for heat dissipation at the pin and socket interface. This lowers temperature rise and reduces potential failures. RADSOK Power-to-Board products are designed to be applied manually by press-fit or by a re-flow solder process eliminating the need for additional wires and/or special crimp tools.