Welcome to the ATS maxiGRIP™ and Board Rework product training module. This presentation is on the use of the latest technology to attach heatsinks to BGA devices that minimizes potential damage to either the component or the PCB itself during the rework process. Considering the cost of a PCB or a BGA package, as well as the cost of board assembly and rework, it is imperative to utilize the best solution available to minimizing such damages. The maxiGRIP™ is one solution that not only delivers enhanced cooling, but also enables the user to avoid any damage to the PCB and the BGA package itself.