ATS’ maxiFLOW heat sinks feature a low profile, spread fin array which allows the heat sink to have a greater surface area for maximum cooling performance. Each is fabricated from extruded aluminum, which minimizes thermal resistance and weight. Their anodized finish enhances surface emissivity and improves thermal performance. Independent testing, at an airflow speed of just 0.5 m/s (100 ft/m), has shown that maxiFLOW heat sinks can reduce device junction temperatures (Tj) by more than 20%, when compared to other heat sinks of similar volume.