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maxiFLOW-heatsink-slide11

ATS’ cooling solutions for application specific integrated circuits (ASICs) also feature maxiFLOW heat sink technology and are specifically designed for their unique cooling requirements. They are available in a wide variety of shapes, sizes and performance levels to support the various ASIC configurations. Each heat sink within this category is available with or without double-sided, thermally conductive, adhesive tape.

PTM Published on: 2011-10-13