Solder Stencils, Templates

Results: 2
Series
-Proto-Advantage BGA
Type
-BGA
Pitch
0.031" (0.80mm)-
Outer Dimension
1.950" L x 1.350" W (49.53mm x 34.29mm)5.000" L x 4.000" W (127.00mm x 101.60mm)
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions
Pitch
Outer Dimension
Inner Dimension
Thermal Center Pad
Material
BGA0002-S
BGA0002-S
STENCIL BGA-324 .8MM
Chip Quik Inc.
16
In Stock
1 : ¥187.62000
Bulk
Bulk
Active
BGA
324
0.031" (0.80mm)
1.950" L x 1.350" W (49.53mm x 34.29mm)
-
-
Stainless Steel
ST0002-S
ST0002-S
PRACTICE KIT STENCIL FOR ST0002
Chip Quik Inc.
9
In Stock
1 : ¥446.47000
Bulk
-
Bulk
Active
-
-
-
5.000" L x 4.000" W (127.00mm x 101.60mm)
-
-
Stainless Steel
Showing
of 2

Solder Stencils, Templates

Solder Stencils and Templates are a mask that is used to apply solder paste in a specific area on a PCB board. The stencil types are BGA, CSP, DFN, DFN/SON, FPC/FFC, HSOP, HTQFP, HTSSOP, LED, LED/DFN, LED/PLCC, LGA, LLP, LQFP, LSOP, mini SOIC, MLP/DFN, MLP/MLF, MQFP, MSOP, PLCC, PLCC/JLCC, POS, PowerQSOP, PowerSOIC, PowerSSO, PowerSSOP, PQFP, PSOP, QFN, QFN/LFCSP, QSOP, RN, RQFP, SOIC, SON, SOP, SOT/SC, SSOP, TO/DDPAK, TO/DPAK, TQFP, TSOC, TSOP, TSSOP, TVSOP, uMAX, VSOP, and VSSOP.