Solder

Results: 2
Composition
Bi57Sn42Ag1 (57/42/1)Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point
279°F (137°C)422 ~ 428°F (217 ~ 220°C)
Process
-Lead Free
Form
Jar, 8.8 oz (250g)Syringe, 0.53 oz (15g), 5cc
Shelf Life
6 Months12 Months
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Composition
Diameter
Melting Point
Flux Type
Wire Gauge
Mesh Type
Process
Form
Shelf Life
Shelf Life Start
Storage/Refrigeration Temperature
NC191SNL250T5
NC191SNL250T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
Chip Quik Inc.
3
In Stock
1 : ¥763.66000
Bulk
Bulk
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
5
Lead Free
Jar, 8.8 oz (250g)
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
NC191LTA15T5
NC191LTA15T5
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
3
In Stock
1 : ¥129.81000
Bulk
Bulk
Active
Solder Paste
Bi57Sn42Ag1 (57/42/1)
-
279°F (137°C)
No-Clean
-
5
-
Syringe, 0.53 oz (15g), 5cc
12 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
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Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.