Solder

Results: 7
Series
-Smooth Flow™Super Low Dross™
Type
Bar SolderSolder PasteWire Solder
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
0.031" (0.79mm)-
Melting Point
280°F (138°C)422 ~ 428°F (217 ~ 220°C)
Flux Type
-No-CleanRosin Activated (RA)
Wire Gauge
21 AWG, 20 SWG-
Mesh Type
45
Form
Bar, 1 lb (454g)Jar, 1.76 oz (50g)Spool, 4 oz (113.40g)Syringe, 0.35 oz (10g), 5ccSyringe, 0.53 oz (15g), 5ccSyringe, 1.23 oz (35g), 10cc
Shelf Life
6 Months60 Months-
Shelf Life Start
-Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)-
Stocking Options
Environmental Options
Media
Marketplace Product
7Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Composition
Diameter
Melting Point
Flux Type
Wire Gauge
Mesh Type
Process
Form
Shelf Life
Shelf Life Start
Storage/Refrigeration Temperature
BARSN96.5AG3.0CU0.5
BARSN96.5AG3.0CU0.5
SOLDER BAR SN96.5/AG3.0/CU0.5 1L
Chip Quik Inc.
4
In Stock
1 : ¥652.11000
Bulk
Bulk
Active
Bar Solder
Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
-
422 ~ 428°F (217 ~ 220°C)
-
-
-
Lead Free
Bar, 1 lb (454g)
-
-
-
NC191SNL15
NC191SNL15
SMOOTH FLOW LEAD-FREE SOLDER PAS
Chip Quik Inc.
13
In Stock
1 : ¥112.44000
Bulk
Bulk
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
4
Lead Free
Syringe, 0.53 oz (15g), 5cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL50
NC191SNL50
SMOOTH FLOW LEAD-FREE SOLDER PAS
Chip Quik Inc.
13
In Stock
1 : ¥121.13000
Bulk
Bulk
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
4
Lead Free
Jar, 1.76 oz (50g)
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
RASWLF.031 4OZ
RASWLF.031 4OZ
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Chip Quik Inc.
53
In Stock
1 : ¥173.12000
Bulk
-
Bulk
Active
Wire Solder
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
0.031" (0.79mm)
422 ~ 428°F (217 ~ 220°C)
Rosin Activated (RA)
21 AWG, 20 SWG
-
Lead Free
Spool, 4 oz (113.40g)
60 Months
Date of Manufacture
-
NC191LT10
NC191LT10
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
0
In Stock
Check Lead Time
1 : ¥69.03000
Bulk
Bulk
Active
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
280°F (138°C)
No-Clean
-
4
Lead Free
Syringe, 0.35 oz (10g), 5cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
NC191SNL15T5
NC191SNL15T5
SMOOTH FLOW LEAD-FREE SOLDER PAS
Chip Quik Inc.
3
In Stock
1 : ¥147.18000
Bulk
Bulk
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
422 ~ 428°F (217 ~ 220°C)
No-Clean
-
5
Lead Free
Syringe, 0.53 oz (15g), 5cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
NC191LT35
NC191LT35
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
5
In Stock
1 : ¥155.86000
Bulk
Bulk
Active
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
280°F (138°C)
No-Clean
-
4
Lead Free
Syringe, 1.23 oz (35g), 10cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
Showing
of 7

Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.