Heat Sinks

Results: 4
Manufacturer
Advanced Thermal Solutions Inc.Boyd Laconia, LLC
Series
-fanSINK™
Packaging
BulkTray
Type
Top MountTop Mount, Skived
Attachment Method
Push PinPush Pin, Thermal Material
Shape
Square, FinsSquare, Pin Fins
Length
2.913" (74.00mm)3.150" (80.00mm)3.307" (84.00mm)
Width
2.913" (74.00mm)3.150" (80.00mm)3.307" (84.00mm)
Fin Height
0.472" (12.00mm)0.768" (19.50mm)0.965" (24.50mm)
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM-
Thermal Resistance @ Natural
5.10°C/W-
Material
-Copper
Material Finish
-AavSHIELD 3C
Stocking Options
Environmental Options
Media
Marketplace Product
4Results
Showing
of 4
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
342949
342949
COPPER HEATSINK 80X80X12MM
Boyd Laconia, LLC
171
In Stock
1 : ¥364.75000
Tray
-
Tray
Active
Top Mount, Skived
BGA
Push Pin
Square, Fins
3.150" (80.00mm)
3.150" (80.00mm)
-
0.472" (12.00mm)
-
1.20°C/W @ 200 LFM
5.10°C/W
Copper
AavSHIELD 3C
ATS-61700W-C2-R0
ATS-61700W-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
129
In Stock
1 : ¥215.17000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
2.913" (74.00mm)
2.913" (74.00mm)
-
0.965" (24.50mm)
-
-
-
-
-
ATS-61800W-C2-R0
ATS-61800W-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
34
In Stock
1 : ¥267.96000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
3.307" (84.00mm)
3.307" (84.00mm)
-
0.965" (24.50mm)
-
-
-
-
-
ATS-61800R-C2-R0
ATS-61800R-C2-R0
FANSINK ASSEMBLY W/ MOUNTING HAR
Advanced Thermal Solutions Inc.
71
In Stock
1 : ¥191.69000
Bulk
Bulk
Active
Top Mount
BGA
Push Pin, Thermal Material
Square, Pin Fins
3.307" (84.00mm)
3.307" (84.00mm)
-
0.768" (19.50mm)
-
-
-
-
-
Showing
of 4

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.