Heat Sinks

Results: 5
Manufacturer
Advanced Thermal Solutions Inc.CTS Thermal Management ProductsCUI Devices
Series
-APFHSB
Packaging
BoxBulk
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)BGA
Attachment Method
Adhesive (Not Included)Thermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
Square, FinsSquare, Pin Fins
Length
0.335" (8.50mm)0.669" (17.00mm)0.748" (19.00mm)
Width
0.335" (8.50mm)0.669" (17.00mm)0.748" (19.00mm)
Fin Height
0.236" (6.00mm)0.250" (6.35mm)0.315" (8.00mm)0.453" (11.50mm)0.571" (14.50mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C2.5W @ 75°C3.1W @ 75°C-
Thermal Resistance @ Forced Air Flow
7.10°C/W @ 200 LFM8.40°C/W @ 200 LFM13.10°C/W @ 200 LFM15.50°C/W @ 200 LFM16.00°C/W @ 200 LFM
Thermal Resistance @ Natural
23.91°C/W29.73°C/W39.10°C/W-
Material
AluminumAluminum Alloy
Stocking Options
Environmental Options
Media
Marketplace Product
5Results
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of 5
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
6,425
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
3,804
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,602
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
5,870
In Stock
1 : ¥39.90000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.571" (14.50mm)
-
15.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
0
In Stock
Active
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.250" (6.35mm)
-
7.10°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 5

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.