Heat Sinks

Results: 2
Manufacturer
CUI DevicesEnclustra FPGA Solutions
Series
ACC-HS4HSB
Type
-Top Mount
Package Cooled
-BGA
Attachment Method
Adhesive (Not Included)Bolt On
Shape
RectangularSquare, Pin Fins
Length
0.335" (8.50mm)2.913" (74.00mm)
Width
0.335" (8.50mm)2.126" (54.00mm)
Fin Height
0.315" (8.00mm)0.571" (14.50mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C-
Thermal Resistance @ Forced Air Flow
16.00°C/W @ 200 LFM-
Thermal Resistance @ Natural
39.10°C/W-
Material
-Aluminum Alloy
Material Finish
-Black Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
Showing
of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
3,779
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
82
In Stock
1 : ¥347.44000
Box
Box
Active
-
-
Bolt On
Rectangular
2.913" (74.00mm)
2.126" (54.00mm)
-
0.571" (14.50mm)
-
-
-
-
-
Showing
of 2

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.